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thermal compound use For LED and CPU Electronics

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ShenZhen Bonyx Electronic Co.,ltd
ShenZhen Bonyx Electronic Co.,ltd

thermal compound use For LED and CPU Electronics

Place of Origin : China
Brand Name : Bonyx
Model Number : HC
Certification : RoHS/ SGS
Price : 0.55USD/pcs
Delivery Time : 3 - 7 days
Payment Terms : paypal or T/T
MOQ : 1000/pcs
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Product introduction

Thermal paste, also known as thermal grease, thermal paste. It has excellent insulating properties, aging resistance, resistance to high temperature (-50 º C~+340 º C), waterproof, moisture-proof not cured. Do not emit heat and by-product, no corrosion on the sealing components, no pollution to the surrounding environment, conforming to RoHs standards and related requirements of environmental protection. Its excellent the heat transfer function can effectively electronic components work transfer heat emitting out.

The scope of application

For any general electronic products, as well as RDRAMTM, CD-ROM, transistors CPU, pipeline transportation equipment, need to be filled and heat items. the device has low working temperature below the critical points, greatly prolongs the lifetime of the components.

Method of use

The smudge tool is the best hard polyester plastic sheet, plastic scraper, first close to the edge a little thermal paste in the radiator, and use a plastic sheet in one direction evenly repeated several times, as long as the surface of the radiator are enough thermal paste covered. No matter what the thermal paste, in the dismantling of the radiator, all the need to deal with various surface, thermal paste new before installation.

Matters needing attention

Paste placed after a period of time will produce precipitation, stirring attention should be paid to the same direction of stirring, otherwise get into too many bubbles, glue the edges of the container and the bottom should also be stirring, otherwise they will be uneven stirring and affect the use effect.

products introduction
Color White Dielectric Constant >5.1
Thermal Conductivity 0.8W/m-K Viscosity no run
Thermal Impedance <0.262℃-in2/W Thixotropic Index 380±10
Specific Gravity >2 MomentBearedTemperature -50~240℃
Evaporation <0.001 Operation Temperture -30~150℃
Silicone Compounds 35%
Carbon Compounds 45%
MetalOxideCompounds 20%

needle tubing hose Mini Pack canning

TU ST SP CN

0.5g~30g 20g~100g 0.5g~3.0g 30g~40KG


Product Tags:

thermal paste

      

thermal compound

      

thermal grease

      
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